Integrated circuit packaging system having planar interconnect and method for manufacture thereof

ABSTRACT

A method for manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This is a continuation of co-pending U.S. patent application Ser. No.12/238,153 filed Sep. 25, 2008.

TECHNICAL FIELD

The present invention relates generally to an integrated circuitpackaging system and more particularly to an integrated circuitpackaging system having an encapsulation.

BACKGROUND ART

Increased miniaturization of components, greater packaging density ofintegrated circuits (“ICs”), higher performance, and lower cost areongoing goals of the computer industry. Semiconductor package structurescontinue to advance toward miniaturization, to increase the density ofthe components that are packaged therein while decreasing the sizes ofthe products that are made therefrom. This is in response to continuallyincreasing demands on information and communication products forever-reduced sizes, thicknesses, and costs, along with ever-increasingperformance.

These increasing requirements for miniaturization are particularlynoteworthy, for example, in portable information and communicationdevices such as cellular phones, hands-free cellular phone headsets,personal data assistants (“PDA's”), camcorders, notebook computers, andso forth. All of these devices continue to be made smaller and thinnerto improve their portability. Accordingly, large-scale IC (“LSI”)packages that are incorporated into these devices are required to bemade smaller and thinner. The package configurations that house andprotect LSI require them to be made smaller and thinner as well.

Many conventional semiconductor (or “chip”) packages are of the typewhere a semiconductor die is molded into a package with a resin, such asan epoxy molding compound. Numerous package approaches stack multipleintegrated circuit dice or package in package (PIP) or a combination.Other approaches include package level stacking or package on package(POP).

Typically, semiconductor packages containing multiple integratedcircuits require either special connection sites on the base substrate,an interposer between semiconductor dice, or both in order for bothintegrated circuits to communicate with the base substrate. Such anarrangement increases vertical and horizontal profile, increases thenumber of manufacturing steps as well as cost of the resultant package.

Thus, a need still remains for an integrated circuit packaging systemproviding low profile, low cost manufacturing, improved yield, andimproved reliability. In view of the ever-increasing need to save costsand improve efficiencies, it is more and more critical that answers befound to these problems.

Solutions to these problems have been long sought but prior developmentshave not taught or suggested any solutions and, thus, solutions to theseproblems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides a method for manufacture of an integratedcircuit packaging system including: mounting an integrated circuit,having a planar interconnect, over a carrier with the planarinterconnect at a non-active side of the integrated circuit and anactive side of the integrated circuit facing the carrier; connecting theintegrated circuit and the carrier; connecting the planar interconnectand the carrier; and forming an encapsulation over the integratedcircuit, the carrier, and the planar interconnect.

The present invention provides an integrated circuit packaging systemincluding: a carrier; an integrated circuit, having a planarinterconnect, over the carrier with the planar interconnect, at anon-active side of the integrated circuit, connected to the carrier andan active side of the integrated circuit facing and connected to thecarrier; and an encapsulation over the integrated circuit, the carrier,and the planar interconnect.

Certain embodiments of the invention have other aspects in addition toor in place of those mentioned or obvious from the above. The aspectswill become apparent to those skilled in the art from a reading of thefollowing detailed description when taken with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of an integrated circuit packaging system in afirst embodiment of the present invention;

FIG. 2 is a cross-sectional view of the integrated circuit packagingsystem along line 2-2 of FIG. 1;

FIG. 3 is a cross-sectional view of an integrated circuit packagingsystem exemplified by the top view of FIG. 1 along line 2-2 in a secondembodiment of the present invention;

FIG. 4 is a cross-sectional view of the integrated circuit packagingsystem exemplified by the top view of FIG. 1 along line 2-2 in a thirdembodiment of the present invention;

FIG. 5 is a top view of an integrated circuit packaging system in afourth embodiment of the present invention;

FIG. 6 is a cross-sectional view of an integrated circuit packagingsystem along line 6-6 of FIG. 5;

FIG. 7 is a cross-sectional view of an integrated circuit packagingsystem exemplified by the top view of FIG. 5 along line 6-6 in a fifthembodiment of the present invention;

FIG. 8 is a top view of an integrated circuit packaging system in asixth embodiment of the present invention;

FIG. 9 is a cross-sectional view of the integrated circuit packagingsystem along 9-9 of FIG. 8;

FIG. 10 is a top view of an integrated circuit package-on-package systemin a first application example of the integrated circuit packagingsystem of FIG. 1 in a seventh embodiment of the present invention;

FIG. 11 is a cross-sectional view of the integrated circuitpackage-on-package system along line 11-11 of FIG. 10;

FIG. 12 is a top view of an integrated circuit package-on-package systemin a second application example of the integrated circuit packagingsystem of FIG. 1 in an eighth embodiment of the present invention;

FIG. 13 is a cross-sectional view of the integrated circuitpackage-on-package system along line 13-13 of FIG. 12; and

FIG. 14 is a flow chart of an integrated circuit packaging system formanufacture of the integrated circuit packaging system in an embodimentof the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

The following embodiments are described in sufficient detail to enablethose skilled in the art to make and use the invention. It is to beunderstood that other embodiments would be evident based on the presentdisclosure, and that system, process, or mechanical changes may be madewithout departing from the scope of the present invention.

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known circuits, system configurations, and process steps are notdisclosed in detail. Likewise, the drawings showing embodiments of thesystem are semi-diagrammatic and not to scale and, particularly, some ofthe dimensions are for the clarity of presentation and are shown greatlyexaggerated in the drawing FIGs. Generally, the invention can beoperated in any orientation.

In addition, where multiple embodiments are disclosed and describedhaving some features in common, for clarity and ease of illustration,description, and comprehension thereof, similar and like features one toanother will ordinarily be described with like reference numerals. Theembodiments have been numbered first embodiment, second embodiment, etc.as a matter of descriptive convenience and are not intended to have anyother significance or provide limitations for the present invention.

For expository purposes, the term “horizontal” as used herein is definedas a plane parallel to the plane or surface of the integrated circuit,regardless of its orientation. The term “vertical” refers to a directionperpendicular to the horizontal as just defined. Terms, such as “above”,“below”, “bottom”, “top”, “side” (as in “sidewall”), “higher”, “lower”,“upper”, “over”, and “under”, are defined with respect to the horizontalplane.

The term “on” means there is direct contact among elements. The term“processing” as used herein includes deposition of material, patterning,exposure, development, etching, cleaning, molding, and/or removal of thematerial or as required in forming a described structure. The term“system” as used herein means and refers to the method and to theapparatus of the present invention in accordance with the context inwhich the term is used.

Referring now to FIG. 1, therein is shown a top view of an integratedcircuit packaging system 100 in a first embodiment of the presentinvention. The top view depicts an integrated circuit 102, such as anintegrated circuit die, having a planar interconnect 104. The planarinterconnect 104 can be along a non-active side 105 and is flat with nobends over the length thereof along one plane from end to end.

The planar interconnect 104 can be formed on the integrated circuit 102at wafer level. The planar interconnect 104 can include a protectionlayer (not shown) to seal portions of the planar interconnect 104 andexposing other portions for electrical connection. An encapsulation 106,such as a cover including an epoxy molding compound, can be over theintegrated circuit 102. The encapsulation 106 can include a cavity 108exposing the integrated circuit 102 and the planar interconnect 104.

Referring now to FIG. 2, therein is shown a cross-sectional view of theintegrated circuit packaging system 100 along line 2-2 of FIG. 1. Theintegrated circuit 102 includes the non-active side 105 and an activeside 207 with the active side 207 having active circuitry fabricatedthereon.

The integrated circuit 102 can be mounted over a carrier 212, such as asubstrate, using an adhesive 214, such as a die attach adhesive.Connection sites 210, such as bond pads, at the active side 207, can befacing the carrier 212. The carrier 212 can have an opening 216. Theintegrated circuit 102 can be positioned over the carrier 212 such thatthe connection sites 210 are over the opening 216.

A first interconnect 218, such as a bond wire or ribbon bond wire, canconnect the connection sites 210 and the carrier 212 through the opening216. A second interconnect 220, such as a bond wire or ribbon bond wire,can connect the planar interconnect 104 and the carrier 212. Theencapsulation 106 can be formed over the carrier 212 covering the firstinterconnect 218 and the second interconnect 220.

The encapsulation 106 can form the cavity 108 over the carrier 212exposing a portion of the planar interconnect 104. The encapsulation 106can form a protrusion 222 under the opening 216 and under the carrier212. The protrusion 222 can extend beyond the opening 216 for sealingthe first interconnect 218. Package interconnects 224, such as solderballs, can attach to and below the carrier 212.

It has been discovered that the present invention provides an integratedcircuit packaging system with lower vertical profile. The integratedcircuit packaging system has a lower vertical profile by forming aplanar interconnect along the non-active side of the integrated circuit.

Referring now to FIG. 3, is a cross-sectional view of an integratedcircuit packaging system 300 exemplified by the top view of FIG. 1 alongline 2-2 in a second embodiment of the present invention. The integratedcircuit packaging system 300 includes structural similarities to theintegrated circuit packaging system 100 of FIG. 2.

The cross-sectional view shows an integrated circuit 302, such as a flipchip, mounted over a carrier 312, such as a substrate. The integratedcircuit 302 includes a non-active side 305 and an active side 307 withthe active side 307 having active circuitry fabricated thereon. Deviceinterconnects 326, such as solder balls, can connect connection sites310, such as bond pads, at the active side 307 to the carrier 312.

A planar interconnect 304 can be formed along the non-active side 305. Afirst interconnect 318, such as bond wires or ribbon bond wires, can beconnect to the carrier 312 and the planar interconnect 304.

Referring now to FIG. 4, therein is shown a cross-sectional view of anintegrated circuit packaging system 400 exemplified by the top view ofFIG. 1 along line 2-2 in a third embodiment of the present invention.The integrated circuit packaging system 400 includes structuralsimilarities to the integrated circuit packaging system 100 of FIG. 2.

The integrated circuit packaging system 400 includes an integratedcircuit 402, such as an integrated circuit die, having a non-active side405 and an active side 407 with the active side 407 having activecircuitry fabricated thereon. The integrated circuit 402 can mount overa carrier 412, such as a substrate, having openings 416.

The integrated circuit 402 can have connection sites 410, such as bondpads, at the active side 407. The connection sites 410 can be positionedover the both of the openings 416. A first interconnect 418, such as abond wire or ribbon bond wire, can connect the connection sites 410 tothe carrier 412 through the openings 416.

Referring now to FIG. 5, therein is shown a top view of an integratedcircuit packaging system 500 a fourth embodiment of the presentinvention. The top view depicts an encapsulation 506, such as a coverincluding epoxy molding compound, formed around and exposing mountinginterconnects 528, such as planarized solder bumps, planarizedconductive posts, or planarized stud bumps.

For illustrative purposes, the integrated circuit packaging system 500is shown having a square geometric configuration, although it isunderstood that the integrated circuit packaging system 500 can have adifferent geometric configuration. For example, the integrated circuitpackaging system 500 can have a rectangular configuration.

Referring now to FIG. 6, therein is shown a cross-sectional view of theintegrated circuit packaging system 500 along line 6-6 of FIG. 5. Theintegrated circuit packaging system 500 includes structural similaritiesto the integrated circuit packaging system 100 of FIG. 2.

The mounting interconnects 528 can attach to a planar interconnect 604along a non-active side 605 of an integrated circuit 602, such as anintegrated circuit die. The integrated circuit 602 can include an activeside 607 with the active side 607 having active circuitry fabricatedthereon.

The encapsulation 506 can be formed over a carrier 612 covering theintegrated circuit 602, the planar interconnect 604, and the mountinginterconnects 528. The encapsulation 506 can continue in its formationwith a removal or planarization process to ground or etched a top side629 of the encapsulation 506 to expose the mounting interconnects 528.The encapsulation 506 provides structure rigidity to the mountinginterconnects 528 to withstand mounting forces.

It has also been discovered that the present invention provides theintegrated circuit packaging system that is formed with an encapsulationwith a profile above the integrated circuit. This encapsulated mountinginterconnects prevent die cracking by covering the non-active side andthe planar interconnect with the encapsulation.

Referring now to FIG. 7, therein is shown a cross-sectional view of anintegrated circuit packaging system 700 exemplified by the top view ofFIG. 5 along line 6-6 in a fifth embodiment of the present invention.The integrated circuit packaging system 700 includes structuralsimilarities to the integrated circuit packaging system 100 of FIG. 2.

Mounting interconnects 728, such as stacked stud bumps, can attach to aplanar interconnect 704 along a non-active side 705 of an integratedcircuit 702, such as an integrated circuit die. The mountinginterconnects 728 can be formed by a number of processes. For example,the mounting interconnects 728 can be formed with wire bonding machineforming the stack of wire bumps.

An encapsulation 706 can be formed over a carrier 712, such as asubstrate, covering the integrated circuit 702, the planar interconnect704, and the mounting interconnects 728. The encapsulation 706 cancontinue in its formation with a removal or planarization process toground or etched a top side 729 of the encapsulation 706 to expose themounting interconnects 728.

Referring now to FIG. 8, therein is shown a top view of an integratedcircuit packaging system 800 in a sixth embodiment of the presentinvention. The top view depicts an encapsulation 806, such as a coverincluding an epoxy molding compound, formed around mountinginterconnects 828. The encapsulation 806 can include a cavity 808exposing the mounting interconnects 828.

For illustrative purposes, the integrated circuit packaging system 800is shown having a square geometric configuration, although it isunderstood that the integrated circuit packaging system 800 can have adifferent geometric configuration. For example, the integrated circuitpackaging system 800 can have a rectangular configuration.

Referring now to FIG. 9, therein is shown a cross-sectional view of theintegrated circuit packaging system 800 along 9-9 of FIG. 8. Theintegrated circuit packaging system 800 includes structural similaritiesto the integrated circuit packaging system 100 of FIG. 2.

The mounting interconnects 828 can attach to a planar interconnect 904along a non-active side 905 of an integrated circuit 902, such as anintegrated circuit die. The integrated circuit 902 can include an activeside 907 having active circuitry fabricated thereon. The encapsulation806 can be formed over a carrier 912, such as a substrate, covering theintegrated circuit 902 with the mounting interconnects 828 exposed inthe cavity 808.

Referring now to FIG. 10, therein is shown a top view of an integratedcircuit package-on-package system 1000 in a first application example ofthe integrated circuit packaging system 100 of FIG. 1 in a seventhembodiment of the present invention. The integrated circuitpackage-on-package system 1000 includes a mounting interposer 1130, suchas a substrate interposer, mounted over the integrated circuit packagingsystem 100. Mounting devices 1134, such as packaged integrated circuits,flip chips, or passive devices, can mount over the mounting interposer1130.

Referring now to FIG. 11, therein is shown a cross-sectional view of theintegrated circuit package-on-package system 1000 along line 11-11 ofFIG. 10. The mounting interposer 1130 can be mounted over the integratedcircuit packaging system 100.

Interposer interconnects 1132, such as solder balls, can connect themounting interposer 1130 the planar interconnect 104. The interposerinterconnects 1132 can be located within the cavity 108 of theintegrated circuit packaging system 100.

The mounting devices 1134 can be mounted over the mounting interposer1130. The mounting devices 1134 can connect to the mounting interposer1130 with device interconnects 1136, such as solder balls.

Referring now to FIG. 12, therein is shown a top view of an integratedcircuit package-on-package system 1200 in a second application exampleof the integrated circuit packaging system 100 of FIG. 1 in an eighthembodiment of the present invention. The integrated circuit packagingsystem 100 having the planar interconnect 104 exposed with the cavity108 in the encapsulation 106.

Referring now to FIG. 13, therein is shown a cross-sectional view of theintegrated circuit package-on-package system 1200 along line 13-13 ofFIG. 12. The integrated circuit packaging system 100 of FIG. 2 can bestacked forming the integrated circuit package-on-package system 1200.

The package interconnects 224 of the integrated circuit packaging system100 at the top of the stack can connect to the planar interconnect 104of the bottom of the stack. For illustrative purposes, the integratedcircuit packaging system 100 is shown with two of the integrated circuitpackaging system 100 stacked, although it is understood that in otherembodiments can stack more than two of the integrated circuit packagingsystem 100.

Referring now to FIG. 14, therein is shown a flow chart of an integratedcircuit packaging system 1400 for manufacture of the integrated circuitpackaging system 100 in an embodiment of the present invention. Thesystem 1400 includes mounting an integrated circuit, having a planarinterconnect, over a carrier with the planar interconnect at anon-active side of the integrated circuit and an active side of theintegrated circuit facing the carrier in a block 1402; connecting theintegrated circuit and the carrier in a block 1404; connecting theplanar interconnect and the carrier in a block 1406; and forming anencapsulation over the integrated circuit, the carrier, and the planarinterconnect in a block 1408.

Yet other important aspects of the embodiments include that it valuablysupports and services the historical trend of reducing costs,simplifying systems, and increasing performance.

These and other valuable aspects of the embodiments consequently furtherthe state of the technology to at least the next level.

Thus, it has been discovered that the integrated circuit packagingsystem of the present invention furnishes important and heretoforeunknown and unavailable solutions, capabilities, and functional aspectsfor improving reliability in systems. The resulting processes andconfigurations are straightforward, cost-effective, uncomplicated,highly versatile, and effective, can be implemented by adapting knowntechnologies, and are thus readily suited for efficiently andeconomically manufacturing integrated circuit package devices.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations that fall within thescope of the included claims. All matters hithertofore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

1. A method for manufacture of an integrated circuit packaging systemcomprising: mounting an integrated circuit, having a planarinterconnect, over a carrier with the planar interconnect at anon-active side of the integrated circuit and an active side of theintegrated circuit facing the carrier; connecting the integrated circuitand the carrier; connecting the planar interconnect and the carrier; andforming an encapsulation over the integrated circuit, the carrier, andthe planar interconnect.
 2. The method as claimed in claim 1 whereinforming the encapsulation includes forming the encapsulation having acavity with the planar interconnect exposed by the cavity.
 3. The methodas claimed in claim 1 wherein connecting the integrated circuit includesconnecting the active side and the carrier through an opening of thecarrier.
 4. The method as claimed in claim 1 further comprising: forminga mounting interconnect over the planar interconnect; and exposing themounting interconnect from the encapsulation.
 5. The method as claimedin claim 1 further comprising: forming a mounting interconnect over theplanar interconnect; and exposing the mounting interconnect with acavity in the encapsulation.
 6. A method for manufacture of anintegrated circuit packaging system comprising: mounting an integratedcircuit, having a planar interconnect, over a carrier with an adhesiveand with the planar interconnect at a non-active side of the integratedcircuit and an active side of the integrated circuit facing the carrier;connecting the active side and the carrier; connecting the planarinterconnect and the carrier; forming an encapsulation over theintegrated circuit, the carrier, and the planar interconnect; andattaching a package interconnect below the carrier.
 7. The method asclaimed in claim 6 wherein: connecting the active side includesconnecting a first interconnect between the active side and the carrierthrough an opening of the carrier; and forming the encapsulationincludes forming the encapsulation through the opening for covering thefirst interconnect.
 8. The method as claimed in claim 6 furthercomprising attaching a mounting device over the planar interconnect. 9.The method as claimed in claim 6 further comprising mounting a mountinginterposer over the planar interconnect.
 10. The method as claimed inclaim 6 wherein connecting the active side and the carrier includesconnecting a device interconnect over the carrier.
 11. An integratedcircuit packaging system comprising: a carrier; an integrated circuit,having a planar interconnect, over the carrier with the planarinterconnect, at a non-active side of the integrated circuit, connectedto the carrier and an active side of the integrated circuit facing andconnected to the carrier; and an encapsulation over the integratedcircuit, the carrier, and the planar interconnect.
 12. The system asclaimed in claim 11 wherein the encapsulation includes a cavity with theplanar interconnect exposed by the cavity.
 13. The system as claimed inclaim 11 wherein the carrier includes the carrier having an opening withthe active side and the carrier connected through the opening.
 14. Thesystem as claimed in claim 11 further comprising a mounting interconnectover the planar interconnect and exposed from the encapsulation.
 15. Thesystem as claimed in claim 11 further comprising: an adhesive betweenthe integrated circuit and the carrier; and a package interconnect belowthe carrier.
 16. The system as claimed in claim 15 further comprising: afirst interconnect between the active side and the carrier through anopening of the carrier; and wherein the encapsulation includes: theencapsulation through the opening for covering the first interconnect.17. The system as claimed in claim 15 further comprising a mountingdevice over the planar interconnect.
 18. The system as claimed in claim15 further comprising a mounting interposer over the planarinterconnect.
 19. The system as claimed in claim 15 further comprising adevice interconnect between the active side and the carrier with thedevice interconnect over the carrier.